Samco FlexLiner II Surface Treatment Systems other packaging machinery
Nuremberg
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+49 89 38031644
Germany, Location:münster
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Manufacturer
Samco
Model
FlexLiner II
Year of Manufacture
2018
Type of Machine
UCP plasma machine
The samco-ucp FlexLiner II is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages. This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head. Dimensions: 1,520 mm (W) x 1,410 mm (D) x 2,130 mm (H)
Key Features and Benefits
Single substrate production equipment for various types and dimensions of substrates and magazines up to 300 mm x 300 mm
Gentle handling with minimal movement of substrates and magazines
Touchscreen GUI for user-friendly
intuitive operation
Multiple sensor controls for highly reliable operation
High throughput due to simultaneous (un)loading and plasma processing
Typical process gases Ar
H2 and N2 for optimum surface activation and soft chemical removal
Applications
Surface cleaning of metal leadframes
plastic microelectronic packages
MEMS or micro-optic packages
hybrid or multi-chip modules
Surface treatment for improvement of gluing
bonding or encapsulation
Mainly surface activation and removal of oxides or organic residues
Optimum plasma processing for a variety of materials in semiconductor technology
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